2N5003 Transistor


Posted on Feb 6, 2014

Derating is the method of decreasing a devices operational limits as temperature is increased, in this case derating a devices operational power dissipation vs increasing ambient temperature. Ambient temperature. is the air temperature measured below a semiconductor device, in an environment of substantially uniform temperature [Still-Air], cooled


2N5003 Transistor
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only by natural air convection [Free-Air], and not materially affected by reflective and radiant surfaces. Near-by devices that may induce heat onto this device is not accounted for in any derating curve. Case mount. A type of package which provides a method of readily attaching one surface of the semiconductor device to a heat sink [heat dissipater] to achieve thermal management of the case temperature. Attaching a device to a heat sink greatly reduces the requirement to derate the device over temperature. The 2N5003 is a case mount package which could be bolted to a metal panel, a Conductive Adhesive Compound will greatly effect heat conduction. Design note; because the stud or case is isolated from the terminals there is no need for an Electrically Conductive Adhesive Compound. Case temperature. is that temperature measured at a specified point on the case of a semiconductor device. Some Temperature-Power derating curves show maximum power by ambient temperature [Ta] while some show maximum power by case temperature [Tc], the two curves are entirely different. Note that the curve above shows the maximum 2N5003 case temperature. Thermal resistance. Thermal resistance is the temperature rise, per unit power dissipation, of a junction above the temperature of a stated external reference point under conditions of thermal equilibrium. Check the derating curves for Thermal resistance.




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