This book describes in the simplest possible terms, the signal integrity problems and the fundamental principles needed to understand how the physical design influences signal integrity. Most easily defined, signal integrity is all about how the physical design of the interconnects -- printed circuit board traces, connectors, IC packages and cables -- corrupt the perfect, pristine signals coming off the chips. The electrical properties of the interconnects play a key role in all electronic products operating above 50 MHz clock frequency, such as computers, wireless, rf and telecommunications products. Interconnects can degrade the electrical performance of a system in four ways: ringing, cross talk, noise in the power and ground distribution network and electromagnetic interference (EMI). These signal integrity problems can be reduced to acceptable levels by careful design of the circuit board layout, materials selection and component design and selection. Any product designer that touches the product can have an impact on signal integrity. The key differentiator between our book and all the others written on signal integrity, is the starting level for the material.Most books either present a lot of mathematical derivation or present formulas as facts, merely describing what they are. Bogatin's book offers explanations that will feed the intuition of the engineers, without hiding behind the equations.