BYG70
#BYG70
#rectifier diode
#high voltage
#fast recovery
#power electronics
#switching
Here is a detailed HTML-formatted technical summary for the BYG70 component:
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BYG70 Technical Summary
BYG70 Rectifier Diode Technical Summary
Overview
The BYG70 is a high-performance, surface-mount rectifier diode designed for demanding applications requiring reliable power conversion and protection. Packaged in a DO-214AC (SMA) form factor, this glass passivated device offers excellent electrical characteristics and thermal performance in a compact footprint.
Engineered for efficiency and durability, the BYG70 is particularly suitable for switching power supplies, DC-DC converters, and reverse polarity protection circuits where space constraints and performance are critical factors.
Key Features
- Glass passivated junction for enhanced reliability
- High maximum operating temperature range
- Low forward voltage drop for improved efficiency
- Fast switching characteristics
- DO-214AC (SMA) surface-mount package
- High surge current capability
- Lead-free and RoHS compliant
- Moisture sensitivity level (MSL) 1, suitable for standard SMT processes
Applications
The BYG70 is versatile and finds use in numerous electronic applications including:
- Switch-mode power supplies (SMPS)
- DC-DC converters
- Reverse polarity protection circuits
- Freewheeling diodes
- Battery charging circuits
- Power management systems
- Automotive electronics
- Industrial power systems
- Consumer electronics power supplies
Electrical Characteristics
Absolute Maximum Ratings
| Parameter | Symbol | Value | Unit |
|---|---|---|---|
| Peak Repetitive Reverse Voltage | VRRM | See specific variant | V |
| Average Rectified Output Current | IF(AV) | 1.0 | A |
| Non-Repetitive Peak Surge Current (8.3ms single half sine-wave) | IFSM | 30 | A |
| Operating Junction Temperature | TJ | -65 to +150 | °C |
| Storage Temperature Range | TSTG | -65 to +150 | °C |
Electrical Characteristics (TA = 25°C unless otherwise specified)
| Parameter | Symbol | Test Conditions | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| Forward Voltage | VF | IF = 1.0A | - | 0.95 | 1.1 | V |
| Reverse Current | IR | VR = VRRM, TA = 25°C | - | - | 5.0 | µA |
| Reverse Current | IR | VR = VRRM, TA = 125°C | - | - | 100 | µA |
| Junction Capacitance | CJ | VR = 4.0V, f = 1MHz | - | 15 | 25 | pF |
Package Information
DO-214AC (SMA) Package Dimensions
| Dimension | Millimeters | Inches |
|---|---|---|
| Length | 4.30 ± 0.20 | 0.169 ± 0.008 |
| Width | 2.69 ± 0.20 | 0.106 ± 0.008 |
| Height | 1.90 ± 0.20 | 0.075 ± 0.008 |
| Lead Width | 1.30 ± 0.20 | 0.051 ± 0.008 |
Package Marking
The device is marked with the following information:
- First line: Manufacturer's logo or identifier
- Second line: Part number (BYG70)
- Third line: Date code or lot number
Recommended PCB Land Pattern
The recommended solder pad layout for the DO-214AC package is as follows:
- Pad width: 2.5mm (0.098") minimum
- Pad length: 3.0mm (0.118") minimum
- Pad spacing: 1.5mm (0.059") between pads
Thermal Characteristics
| Parameter | Symbol | Value | Unit |
|---|---|---|---|
| Thermal Resistance, Junction to Ambient | RθJA | 75 | °C/W |
