The K4E641612C is a 4Mx16 Extended Data Out (EDO) Mode Dynamic Random-Access Memory (DRAM) component manufactured by Samsung. It is part of a DRAM family that includes variants with different refresh cycle capabilities, such as the K4E661612C-TC/L (8K refresh) and the K4E641612C-TC/L (4K refresh). This device is designed for high-bandwidth, low-power applications and is fabricated using Samsung's advanced CMOS process for enhanced reliability.
The K4E641612C supports multiple refresh modes, including CAS-before-RAS refresh, RAS-only refresh, and Hidden refresh. The L-version of this component also features Self-refresh capability, making it suitable for power-sensitive applications. The device operates at a supply voltage of +3.3V ±0.3V and is compatible with LVTTL input and output levels.
The K4E641612C is suitable for a wide range of applications that require high-speed, low-power memory solutions. Common applications include:
The K4E641612C is available in a Plastic Thin Small Outline Package (TSOP) Type II, which is a surface-mount package designed for high-density memory applications. The package dimensions and pin configuration adhere to industry standards, ensuring compatibility with automated assembly processes.
The K4E641612C follows the JEDEC standard pinout for 4Mx16 DRAM devices. Key pins include:
The K4E641612C is a high-performance, low-power 4Mx16 EDO Mode DRAM designed for applications requiring fast data access and efficient power management. With its multiple refresh modes, LVTTL compatibility, and industry-standard packaging, it is a versatile solution for a wide range of computing, embedded, and networking applications. Samsung's advanced CMOS process ensures high reliability and performance, making this component a robust choice for modern electronic systems.