BYG60 - Surface Mount Schottky Barrier Rectifier

Overview

The BYG60 is a high-performance Schottky Barrier Rectifier designed for surface mount applications. Packaged in a DO-214AC (SMA) form factor, this component offers excellent efficiency and reliability in power conversion circuits. With its glass passivated junction and optimized construction, the BYG60 is ideal for high-frequency switching applications where low forward voltage drop and fast switching characteristics are critical.

Key Features

• Glass passivated junction for enhanced reliability
• Low forward voltage drop for improved efficiency
• High maximum operating temperature rating
• Excellent thermal performance in surface mount applications
• Fast switching characteristics
• Low reverse leakage current
• Halogen-free and RoHS compliant
• High surge current capability

Applications

The BYG60 is suitable for a wide range of applications including:

• Switch-mode power supplies (SMPS)
• DC-DC converters
• Reverse polarity protection circuits
• Freewheeling diodes
• OR-ing diodes in power distribution
• High-frequency rectification
• Battery charging circuits
• Solar panel bypass diodes
• Automotive electronics

Electrical Characteristics

Absolute Maximum Ratings

• Maximum repetitive peak reverse voltage: 60V
• Maximum RMS voltage: 42V
• Maximum DC blocking voltage: 60V
• Maximum average forward current: 5A (at TA = 55°C)
• Peak forward surge current: 150A (8.3ms single half sine-wave)
• Operating junction temperature range: -65°C to +150°C
• Storage temperature range: -65°C to +150°C

Thermal Characteristics

• Junction-to-ambient thermal resistance: 50°C/W
• Junction-to-lead thermal resistance: 25°C/W

Forward Characteristics

• Forward voltage (VF): 0.55V typical at 3A, 25°C
• Forward voltage (VF): 0.70V maximum at 5A, 25°C
• Forward voltage temperature coefficient: -1.4mV/°C

Reverse Characteristics

• Reverse leakage current (IR): 0.5mA maximum at 60V, 25°C
• Reverse leakage current (IR): 10mA maximum at 60V, 150°C
• Typical junction capacitance: 150pF at 4V, 1MHz

Package Information

DO-214AC (SMA) Package Dimensions

• Package style: Surface mount
• Package dimensions: 4.3mm x 2.6mm x 2.1mm (L x W x H)
• Terminal material: Matte tin-plated copper
• Terminal finish: RoHS compliant
• Mounting: Surface mount (SMD)
• Weight: Approximately 0.2 grams

Marking Information

• Top side marking: "BYG60"
• Polarity indication: Cathode band marked on body

Recommended PCB Land Pattern

• Pad width: 2.0mm minimum
• Pad length: 3.0mm minimum
• Pad spacing: 1.5mm between pads
• Recommended solder paste: SAC305 or equivalent

Reliability and Qualification

• MIL-STD-750 environmental test qualified
• AEC-Q101 qualified for automotive applications
• MSL Level 1 (unlimited floor life at <30°C/60% RH)
• ESD rating: Class 1C (Human Body Model)

Handling and Soldering Recommendations

• Recommended reflow profile: IPC/JEDEC J-STD-020
• Maximum soldering temperature: 260°C for 10 seconds
• Handling precautions: ESD sensitive - use proper grounding
• Storage conditions: Dry pack at <40°C and <90% RH

Performance Characteristics

Forward Voltage vs. Forward Current

The BYG60 exhibits excellent forward characteristics with a typical forward voltage drop of 0.55V at 3A, making it highly efficient for power conversion applications. The forward voltage shows negative temperature coefficient behavior, decreasing slightly with increasing temperature.

Reverse Leakage Current vs. Temperature

Reverse leakage current remains low across the operating temperature range, with typical values below 10μA at room temperature and 60V reverse bias. The leakage current increases exponentially with temperature as expected for Schottky diodes.

Thermal Performance

The DO-214AC package provides excellent thermal performance for surface mount applications. With proper PCB layout and copper area, the device can handle its full rated current while maintaining safe operating temperatures.

Design Considerations

• For optimal thermal performance, use adequate copper area on PCB
• Ensure proper solder fillets for mechanical strength
• Consider parallel devices for higher current applications
• Account for voltage derating at elevated temperatures
• Include appropriate snubber circuits in high-frequency applications