HB52F168EN
HB52F168EN 8-Byte DIMM Synchronous DRAM Module
Overview
The HB52F168EN is a high-performance 8-byte DIMM (Dual In-line Memory Module) designed as an optimized main memory solution for 8-byte processor applications. It belongs to the HB52F series, which includes the HB52F88EM, HB52F89EM, HB52F168EN, and HB52F169EN models. These modules are built using 64-Mbit SDRAMs (HM5264805FTT) in TSOP packages and include a 2-kbit serial EEPROM for Presence Detect (PD) functionality.
The HB52F168EN is specifically organized as an 8M × 64 × 2-bank module, incorporating 16 pieces of 64-Mbit SDRAM. It features a 168-pin socket-type package with dual lead-out, enabling high-density mounting without requiring surface-mount technology. The module includes decoupling capacitors mounted beside each TSOP on the board to enhance signal integrity.
Features
- Compatibility: Fully compliant with JEDEC standard outline for 8-byte DIMMs.
- Package: 168-pin socket type (dual lead-out) with dimensions 133.37 mm (Length) × 34.925 mm (Height) × 4.00 mm (Thickness).
- Power Supply: 3.3 V LVTTL interface.
- Clock Frequency: Supports up to 133 MHz operation.
- Data Bus Width: ×64 non-parity configuration.
- Bank Architecture: 4 banks capable of simultaneous and independent operation.
- Burst Operation: Supports burst read/write and burst read/single write operations.
- Programmable Burst Length: Configurable as 1, 2, 4, 8, or full page.
- Burst Sequence: Supports sequential and interleave modes.
- CAS Latency: Programmable as 3 (for 133 MHz) or 2 (for 100 MHz).
- Byte Control: Managed via DQMB signals.
- Refresh Cycles: 4096 refresh cycles every 64 ms.
- Refresh Modes: Auto-refresh and self-refresh supported.
- Full Page Burst: Capable of full-page burst length in sequential mode with burst stop functionality.
Applications
The HB52F168EN is designed for use in high-performance computing systems requiring reliable and efficient memory solutions. Key applications include:
- Server Systems: Ideal for main memory in servers due to its high density and speed.
- Workstations: Suitable for demanding computational tasks in professional workstations.
- Embedded Systems: Can be used in embedded applications requiring robust memory performance.
- Networking Equipment: Suitable for routers, switches, and other networking hardware.
- Industrial Computing: Reliable operation makes it a good fit for industrial-grade computing systems.
Electrical Characteristics
Absolute Maximum Ratings
- Supply Voltage (VDD): -0.5 V to +4.6 V
- Input Voltage (VIN): -0.5 V to VDD + 0.5 V
- Operating Temperature: 0°C to +70°C (commercial grade)
- Storage Temperature: -55°C to +125°C
Recommended Operating Conditions
- Supply Voltage (VDD): 3.3 V ± 0.3 V
- Clock Frequency: Up to 133 MHz
- CAS Latency: 2 (100 MHz) or 3 (133 MHz)
- Refresh Interval: 64 ms with 4096 cycles
Timing Parameters
- tRC (Row Cycle Time): 60 ns (min)
- tRAS (RAS Active Time): 42 ns (min)
- tRCD (RAS to CAS Delay): 18 ns (min)
- tAC (Access Time): 5.4 ns (max)
- tWR (Write Recovery Time): 1 clock cycle (min)
Package Information
The HB52F168EN is housed in a 168-pin socket-type package with the following mechanical specifications:
- Package Type: 168-pin DIMM socket (dual lead-out)
- Dimensions: 133.37 mm (Length) × 34.925 mm (Height) × 4.00 mm (Thickness)
- Lead Pitch: 1.27 mm
- Mounting: Designed for socket mounting without surface-mount technology
- Weight: Approximately 25 grams (varies based on configuration)
Pin Configuration
The 168-pin configuration includes:
- Power Pins (VDD, VSS): Distributed for stable power delivery
- Address Pins (A0-A11): For row and column addressing
- Data Pins (DQ0-DQ63): 64-bit data bus
- Control Pins (RAS, CAS, WE, CS): For command inputs
- Clock Pins (CLK): Differential clock inputs
- DQMB Pins: Byte control for data masking
Ordering Information
The HB52F168EN is available in multiple configurations. Below is the ordering information for reference:
- HB52F168EN-75F: 133 MHz operation with CAS latency 3
- Note: 100 MHz operation is supported with CAS latency 2.
