HB54A2569

HB54A2569F1 32M × 72 × 1-Bank DDR SDRAM Module Technical Summary

Overview

The HB54A2569F1 is a high-performance 32M × 72 × 1-bank Double Data Rate (DDR) SDRAM module designed for applications requiring high-speed data transfer and reliable memory operations. This module integrates nine 256-Mbit DDR SDRAM chips (HM5425801BTT) in TSOP packages, along with a PLL clock driver, two register drivers, and a 2-kbit serial EEPROM for Presence Detect (PD) functionality. The module is optimized for high-density mounting and features a 184-pin socket-type package, making it suitable for a variety of computing and embedded systems.

Key architectural features include a 2-bit prefetch pipelined design, enabling efficient data throughput, and data strobe (DQS) signals for both read and write operations to ensure high-speed and reliable data bus performance. The module supports configurable on-chip Delay Locked Loop (DLL) settings via the extended mode register, providing flexibility in timing management. Additionally, decoupling capacitors are mounted adjacent to each TSOP on the module board to enhance signal integrity.

Features

• Package: 184-pin socket type (dual lead out)
• Dimensions: 133.35 mm (Length) × 43.18 mm (Height) × 4.00 mm (Thickness)
• Lead pitch: 1.27 mm
• Power Supply: 2.5 V (VCC/VCCQ)
• Interface: SSTL-2 for all inputs and outputs
• Clock Frequency: Up to 100 MHz (max)
• Data Synchronization: Inputs, outputs, and DM synchronized with DQS
• Bank Configuration: 4 independently operable banks
• Burst Operation: Supports burst read/write with programmable burst lengths (2/4/8)
• Burst Sequence: Configurable as sequential or interleave
• Addressing: Supports even and odd start addressing
• CAS Latency: Fixed at 3
• Refresh Cycles: 8192 cycles (7.8 µs per row, 64 ms total)
• Refresh Modes: Auto refresh and self refresh

Applications

The HB54A2569F1 is designed for use in a wide range of applications requiring high-speed, high-density memory solutions. Its robust architecture and reliable performance make it suitable for:

• Enterprise Servers: High-performance computing and data center applications
• Networking Equipment: Routers, switches, and communication infrastructure
• Embedded Systems: Industrial automation, medical devices, and automotive systems
• Graphics Processing: High-bandwidth memory requirements for GPUs and display systems
• Consumer Electronics: Gaming consoles, smart TVs, and multimedia devices

Electrical Characteristics

The following table summarizes the key electrical specifications of the HB54A2569F1 module:

• Operating Voltage: 2.5 V ± 0.2 V (VCC/VCCQ)
• Input/Output Logic Levels: SSTL-2 compliant
• Clock Frequency Range: 100 MHz (max)
• Data Rate: 200 Mbps (DDR operation)
• Power Consumption: Active mode: TBD (typical), Standby mode: TBD (typical)
• Operating Temperature Range: Commercial (0°C to +70°C) or Industrial (-40°C to +85°C)

Package Information

The HB54A2569F1 is housed in a 184-pin socket-type package with dual lead-out configuration. The module's compact design enables high-density mounting without requiring surface-mount technology. Key package details include:

• Dimensions: 133.35 mm (length) × 43.18 mm (height) × 4.00 mm (thickness)
• Lead Pitch: 1.27 mm
• Mounting: Socket-compatible for easy installation and replacement
• Material: High-quality PCB with decoupling capacitors for noise reduction

Ordering Information

The HB54A2569F1 is available in multiple configurations to meet varying performance and environmental requirements. Below is the ordering information for standard variants:

• HB54A2569F1-10B: Standard commercial temperature range (0°C to +70°C)
• HB54A2569F1-10I: Industrial temperature range (-40°C to +85°C)

Conclusion

The HB54A2569F1 DDR SDRAM module is a high-performance memory solution designed for applications demanding speed, reliability, and high-density integration. With its advanced features such as programmable burst operations, multiple refresh modes, and SSTL-2 interface, it is well-suited for enterprise, networking, and embedded systems. The 184-pin socket-type package ensures ease of integration, while the inclusion of decoupling capacitors enhances signal integrity. For detailed datasheets and application notes, refer to the manufacturer's documentation.