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ULN2004A

#ULN2004A #Darlington transistor array #high-voltage #high-current #relay driver #stepper motor driver #DIP #SOIC #NPN #peripheral load driver
ULN2004A Technical Summary

ULN2004A High-Voltage, High-Current Darlington Transistor Array

Overview

The ULN2004A is a high-voltage, high-current Darlington transistor array designed for interfacing between low-level logic circuitry and multiple peripheral power loads. This device is part of the ULN200x series, which includes seven NPN Darlington pairs capable of sinking up to 500 mA per channel. The ULN2004A is particularly suited for driving relays, lamps, LED displays, stepper motors, and other high-current or high-voltage loads.

This component is available in both dual in-line (DIP) and small-outline IC (SOIC) packages, designated as the ULN20xxA and ULN20xxL series respectively. These variants are electrically identical, providing flexibility in board design and space constraints.

Features

Applications

The ULN2004A finds use in numerous applications requiring interface between low-power digital circuits and higher power loads:

Electrical Characteristics

Absolute Maximum Ratings

Electrical Specifications (TA = 25°C unless otherwise noted)

Package Information

16-Pin Dual In-Line Package (DIP)

16-Pin Small Outline IC Package (SOIC)

Functional Description

The ULN2004A contains seven Darlington transistor pairs, each featuring high-voltage outputs with common-cathode clamp diodes for switching inductive loads. Each channel is rated at 500 mA and can withstand peak currents of 600 mA. The Darlington configuration provides high current gain, allowing small input currents to control much larger output currents.

The integrated suppression diodes are connected between each output and the COM pin (pin 9), which must be connected to the positive supply voltage when driving inductive loads. This configuration provides a path for the inductive kickback current when the transistor turns off, protecting both the device and the driving circuitry.

Thermal Considerations

When operating multiple channels simultaneously or driving high currents, thermal management becomes important. The maximum power dissipation for the DIP package is 2.25 W and 1.4 W for the SOIC package. The thermal resistance (θJA) is approximately 60°C/W for the DIP package and 100°C/W for the SOIC package.

For continuous operation at maximum ratings, proper heat sinking or derating may be required. The power dissipation can be calculated using the formula:

PD = VCE(sat) × IC × N

Where N is the number of active channels.

Pin Configuration

Design Considerations

When designing with the ULN2004A, several factors should be considered:

Reliability and Quality

The ULN2004A is manufactured with stringent quality control measures and is qualified to industry standards. The device undergoes multiple tests including:

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