2N6764 FET Derating Curve

MIL-PRF-19500/543; Semiconductor Device, Transistor, Field Effect, N-Channel, Silicon, Repetitive Avalanche Types 2N6764, 2N6764T1, 2N6766, 2N6766T1, 2N6768, 2N6768T1, 2N6770, and 2N6770T1 [TO-204AE; formerly designated as a TO-3] TO-204 Flange mount. [Diamond Base] A package shape which provides a method of readily attaching one surface of the semiconductor device to a heat dissipater [Heat Sink] to achieve thermal management of the case temperature. This semiconductor package has the Drain electrically connected to the case. Additional design data on the TO-204 Package.

The MIL-PRF-19500/543 specification outlines a series of N-channel field effect transistors (FETs) designed for repetitive avalanche applications. These transistors include part numbers such as 2N6764, 2N6764T1, 2N6766, 2N6766T1, 2N6768, 2N6768T1, 2N6770, and 2N6770T1. The devices are encapsulated in a TO-204AE package, which is also known as a TO-3 package. This specific package type is characterized by its diamond base shape, facilitating efficient mounting and thermal management.

The TO-204 package is designed to allow for the direct attachment of one surface of the semiconductor device to a heat sink, which is critical for maintaining optimal operating temperatures, especially in high-power applications. The thermal management is achieved through the package's construction, which ensures that the drain terminal is electrically connected to the case, thereby allowing for effective heat dissipation.

This configuration supports the reliable performance of the transistor under repetitive avalanche conditions, making it suitable for various applications in power electronics. The additional design data related to the TO-204 package further enhances understanding of its thermal and electrical characteristics, ensuring that engineers can effectively integrate these components into their circuit designs.MIL-PRF-19500/543; Semiconductor Device, Transistor, Field Effect, N-Channel, Silicon, Repetitive Avalanche Types 2N6764, 2N6764T1, 2N6766, 2N6766T1, 2N6768, 2N6768T1, 2N6770, and 2N6770T1 [TO-204AE; formerly designated as a TO-3] TO-204 Flange mount. [Diamond Base] A package shape which provides a method of readily attaching one surface of the semiconductor

device to a heat dissipater [Heat Sink] to achieve thermal management of the case temperature. This semiconductor package has the Drain electrically connected to the case. Additional design data on the TO-204 Package. 🔗 External reference